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WLCSP

China Wafer Level CSP Ltd.’s packaging technologies are multifunctional –producing packaging solutions that are miniature, reliable and low cost, thereby exponentially increasing board capacity and functionality for the next generation of smaller, more advanced electronics devices.

The company provides packaging services using the advanced WLCSP technologies – ShellOP™, ShellOC™, ShellUT™, and Wafer Bumping as well as TSV (through silicon via) services to customers worldwide. In addition, China wafer Level CSP provides co-design and qualification services for new products of our existing and new customers.

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